Thermal Adhesive 

 less Know f acts about kafuter thermal adhesive  

 1 . Low Thermal conductivity   2 . long Courring Time More
3 . Less  Quantity More Price  4 . Setting Time High 

8052-SD

SD 8052 0.8 W/M-K Thermally Conductive Adhesive is suitable for use as a thermal interface material where Low Thermal Conductivity required.

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SD-5 

SD-5 1.2 W/M-K Thermally Conductive Adhesive is suitable for use as a thermal interface material where Low Thermal Conductivity required.

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8053-SD

SD-8053 1.2 W/M - K Thermally Conductive Adhesive is suitable for use as a thermal interface material where High Thermal Conductivity required.

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8054-SD

SD-8054  1.5 W/M-K Thermally Conductive Adhesive is suitable for use as a thermal interface material where high Thermal Conductivity required.

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SD-918

SD-918 1.6W/ M-K Thermally Conductive Adhesive is suitable for use as a thermal interface material where high Thermal Conductivity required.

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SD-920

SD-920 2 W/M-K  Thermally Conductive Adhesive is suitable for use as a thermal interface material where High Thermal Conductivity required.

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K-5204K

K-5204 K  1.6 W/M -K Thermally Conductive Adhesive is suitable for use as a thermal interface material where High Thermal Conductivity required.

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K-5203K

K-5203 K 1.2 W/M-K  Thermally Conductive Adhesive is suitable for use as a thermal interface material where Low Thermal Conductivity required.

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MSDS

Dispensing Solution  For Diapensing above Thermal 
Compound 

Digital 

Analogue 

 Glue Dispenser 

Glue Dispenser 

DISPENSER FOR CARGATE DISPENSER