JYD850 HOT AIR BLOWER
 


Application:
Suitable for unsoldering multiple components, such as SOIC, CHIP, QFP, PLCC and BGA. 
Applicable for hot contraction, heating, painting-removing, glue-removing, defrosting, preheating. 
For MacBook, Cellular phones, PDAs, handhelds, laptops, notebooks, and motherboards repair. 

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